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注意:あなたは必要条件ガイドを編集しています。あなたが行なう変更は、この手順を含む全ての8個のガイドに反映されます。

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手順 22を翻訳中

手順22
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

在接下来的几步,你将会使用到 iOpener 来加热 iPad 底部来软化主板的黏胶。

当你重新加热,并把 iOpener 放到这些位置的时候,请保持至少一分钟,来软化黏胶。

黏胶是六个泡沫形式的胶带 ——如果你需要知道它们的位置,请参考这个步骤。

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