手順4に変更
- Arthur Shiによって編集
承認済みの編集 : Arthur Shi
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手順ライン
| [* black] Apply a heated iOpener to the left edge of the phone. | |
| [* black] Use an opening pick to slice through the adhesive on the left edge of the phone. | |
| + | [* black] The adhesive is very thick in some areas. Repeated heat application will help weaken stubborn adhesive. |