手順7に変更
- Salem Jeanによって編集
承認済みの編集 : Salem Jean
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- 後
- 変更なし
手順ライン
- | [* black] Use spudger to lift the motherboard from the phone shell. |
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+ | [* black] Wedge a plastic opening tool between the motherboard and the phones casing. |
+ | [* black] While using one finger to hold down a portion of the phone pull upwards with the plastic opening tool to loosen the motherboard from the phone casing. |
+ | [* black] Once there is some space between the board and the phone case, using your hands carefully lift the motherboard from the phone casing. |