手順14に変更
- Miroslav Djuricによって編集
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手順ライン
| [* black] Time for our favorite part, chip identification! | |
| - | [* red] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-K3PE7E700M-XGC1&viewState=DetailView&cartID=&g=&parentCategory=&navigationStr=CatalogSearchInc&searchText=circuit|K3PE7E00M-XGC1] |
| + | [* red] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-K3PE7E700M-XGC1&viewState=DetailView&cartID=&g=&parentCategory=&navigationStr=CatalogSearchInc&searchText=circuit|K3PE7E00M-XGC1] 8 Gb LPDDR2. |
| [* orange] Hynix H8BCS0QG0MMR memory MCP containing Hynix DRAM and STM flash | |
| [* yellow] Qualcomm [http://www.qualcomm.com/media/releases/2011/02/14/qualcomm-announces-commercial-availability-gobi3000-modules|MDM6600] supporting HSPA+ speeds of up to 14.4 Mbps | |
| [* green] The Qualcomm PM8028 chip works in conjunction with the Qualcomm MDM6600 to provide wireless data connection to the phone. | |
| [* blue] Motorola [https://chipworks.secure.force.com/catalog/ProductDetails?sku=MOT-T6VP0XBG-0001&viewState=DetailView|T6VP0XBG-0001] LCM 2.0 LTE baseband processor. | |
| [* violet] ZE55431140KHD, which appears to be the RAM sitting atop the main processor. | |
| [* black] How do we know the processor is lurking beneath? Check out the chip package-on-package goodness in the second image. The processor is the orange chip beneath the RAM. |