手順3に変更
- Kyle Smithによって編集
承認済みの編集 : Kyle Smith
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手順ライン
| [title] Begin to cut the adhesive | |
| - | [* icon_caution] As you cut through the adhesive around the perimeter of the phone, don't insert the pick more than 5 mm to avoid damaging internal components. |
| [* black] Slide the opening pick along the left edge towards the bottom left corner to cut through the adhesive. | |
| [* black] Leave the pick inserted in the bottom left corner to prevent the adhesive from re-sealing. |