メインコンテンツにスキップ
ヘルプ

現在のバージョン作成者: James Agans ,

テキスト:

+You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain. The lead free solder they use requires around 220C for about 5 minutes to soften. Quite a bit hotter than lead/tin which has worked very well for a very long time until idiots like Al Gore came along. The Ball Grid Array is a very bad idea IMHO. it depends on solder being used as the conductor, and solder can crack under thermal stress (Especially the crap they use) It is not like soldering a wire lead, where the wire has tensile strength, and the solder merely coats the wire. Another bad idea by a bad engineer with no grasp of the physical properties of materials. I see this more and more today, don't you?
+
LG has no idea what they are doing. They should get out of the consumer electronics business. Very poor QC
-
-You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain. The lead free solder they use requires around 220C for about 5 minutes to soften. Quite a bit hotter than lead/tin which has worked very well for a very long time until idiots like Al Gore came along. The Ball Grid Array is a very bad idea IMHO. it depends on solder being used as the conductor, and solder can crack under thermal stress (Especially the crap they use) It is not like soldering a wire lead, where the wire has tensile strength, and the solder merely coats the wire. Another bad idea by a bad engineer with no grasp of the physical properties of materials. I see this more and more today, don't you?

ステータス:

open

編集者: James Agans ,

テキスト:

LG has no idea what they are doing. They should get out of the consumer electronics business. Very poor QC
-You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain. The lead free solder they use requires around 220C for about 5 minutes to soften. Quite a bit hotter than lead/tin which has worked very well for a very long time until idiots like Al Gore came along. The Ball Grid Array is a very bad idea IMHO. it depends on solder which can crack under stress (Especially the crap they use) It is not like soldering a wire lead, where the wire has tensile strength, and the solder merely coats the wire. Another bad idea by a bad engineer with no grasp of the physical properties of materials. I see this more and more today, don't you?
+You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain. The lead free solder they use requires around 220C for about 5 minutes to soften. Quite a bit hotter than lead/tin which has worked very well for a very long time until idiots like Al Gore came along. The Ball Grid Array is a very bad idea IMHO. it depends on solder being used as the conductor, and solder can crack under thermal stress (Especially the crap they use) It is not like soldering a wire lead, where the wire has tensile strength, and the solder merely coats the wire. Another bad idea by a bad engineer with no grasp of the physical properties of materials. I see this more and more today, don't you?

ステータス:

open

編集者: James Agans ,

テキスト:

LG has no idea what they are doing. They should get out of the consumer electronics business. Very poor QC
-You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain.
+You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain. The lead free solder they use requires around 220C for about 5 minutes to soften. Quite a bit hotter than lead/tin which has worked very well for a very long time until idiots like Al Gore came along. The Ball Grid Array is a very bad idea IMHO. it depends on solder which can crack under stress (Especially the crap they use) It is not like soldering a wire lead, where the wire has tensile strength, and the solder merely coats the wire. Another bad idea by a bad engineer with no grasp of the physical properties of materials. I see this more and more today, don't you?

ステータス:

open

オリジナル投稿者: James Agans ,

テキスト:

LG has no idea what they are doing. They should get out of the consumer electronics business. Very poor QC

You can try the baking method, but even if it works, it will only last for a very short time. I tried and it worked for about 5 minutes. I am going to flood the chip with flux and try again, but Im probably pushing chain.

ステータス:

open