I couldn’t find any on Newegg.com or Amazon.com. Google shopping turned up a few; but most if not all look like OEM parts. Anandtech’s predicting m.2 2230 and a new sdcard sized form factor (intended to compete against soldiered eMMC) are going to be common in next generation compact laptops; but right now it looks like it’s going to be slim pickings.
How much deeper do I need to cut with the picks/etc top and bottom. The ~1.5mm of my picks isn’t deep enough to cut all the glue on the bottom (haven’t tried on the top yet); my sides were ‘easy’ to free in that my bad battery already lifed them free leaving the screen secured only top and bottom. I can probe deeper with a card or spudger, but how much farther should I be going.
It had a few bits accessable without the hacksaw. They weren’t able to get at anything in the Surfacebook without cutting the fabric earning it an even worse score.
It gets 1 point for the few things you can get at non-destructively. It only gets 1 point because that’s a small fraction of the total system.