手順 8を翻訳中
手順8
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We checked the
geneticschips in the S8 to see if it is truly a smaller twin of the S8+: -
Samsung K3UH5H50MM-NGCJ 4 GB LPDDR4 RAM layered over the MSM8998 Snapdragon 835
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Toshiba THGBF7G9L4LBATR 64 GB UFS (NAND flash + controller)
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Qualcomm WCD9341 Aqstic audio codec
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Skyworks SKY78160-11 WLAN front end module
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Avago AFEM-9066 power amplifier module
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NXP Semiconductor PN80T NFC controller w/ secure element
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Silicon Mitus SM5720 interface PMIC
| [* black] We checked the ~~genetics~~ chips in the S8 to see if it is truly a smaller twin of the [guide|87086|S8+|stepid=164366|new_window=true]: | |
| [* red] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4x/K3UH5H50MM-NGCJ?ia=3157|K3UH5H50MM-NGCJ|new_window=true] 4 GB LPDDR4 RAM layered over the [https://www.qualcomm.com/products/snapdragon/processors/835|MSM8998|new_window=true] Snapdragon 835 | |
| [* orange] Toshiba [https://www.avnet.com/shop/us/p/memory/flash-card/toshiba/thgbf7g9l4lbatr-3074457345630089328/|THGBF7G9L4LBATR|new_window=true] 64 GB UFS (NAND flash + controller) | |
| - | [* yellow] Qualcomm |
| - | [* green] Skyworks |
| - | [* light_blue] Avago AFEM-9066 |
| - | [* blue] NXP |
| - | [* violet] Silicon Mitus SM5720 |
| + | [* yellow] Qualcomm [https://www.qualcomm.com/news/releases/2017/01/03/qualcomm-snapdragon-835-mobile-platform-power-next-generation-immersive|WCD9341|new_window=true] Aqstic audio codec |
| + | [* green] Skyworks SKY78160-11 WLAN front end module |
| + | [* light_blue] Avago AFEM-9066 power amplifier module |
| + | [* blue] NXP Semiconductor [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T] NFC controller w/ secure element |
| + | [* violet] Silicon Mitus SM5720 interface PMIC |
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