For soldering, the soldering method is the same as the desoldering method. You need to put the component in position firstly and pay attention to the temperature as well as airflow.

Next, let’s see how to desolder large chips with hot air gun. Corner adhesive needs to be removed when we use hot air gun to desolder large chips like NAND. Helical wind hot air gun is used to desolder these kinds of large chips. Please apply high-temperature tape around the component to protect surrounding components.

The temperature should be set around 365 °C-400 °C and airflow around 45-65. The nozzle should be kept vertical from the component with a distance of 6-8 mm.

You should heat evenly above the component for about 40 seconds. Then pry up the component with a pry blade.

In summary, the nozzle of hot air gun should be kept vertical from the soldering surface with a suitable distance. Other than that, the temperature and airflow of the hot air gun must be set properly according to the actual repair circumstances.