Correct use of the hot air gun can enhance repair efficiency while incorrect use can damage the phone.

The temperature and airflow of the hot air gun must meet special requirements in different scenarios. The component can’t be removed or soldering will be defective if the temperature is set too low while components and PCB board will be damaged under high temperature.

What’s more, components will get blown away if the airflow is set too high. Therefore, proper use of the hot air gun is the key to phone repair Then we will show you how to use hot air gun properly for phone repair. First of all, let’s take a look at how to desolder small components.

Vertical wind hot air gun is used to desolder these kinds of components. The temperature should be set around 330 °C-365 °C and airflow around 1-3. Because the vertical wind hot air gun heats up so quickly, please wait to begin working until the temperature is stable after starting up.

In addition, the nozzle should be kept vertical from the component with a distance of 3-6 mm. You should heat evenly above the component for about 13-18 seconds. Then remove the component with tweezers.