注意:あなたはさきほど閲覧しているガイドの前提となるページを編集しています。あなたが行った変更は、この手順を含むガイド全体に影響を与えます。
手順 3を翻訳中
手順3
-
Insert a spudger underneath the shield plate along the edge of the device.
-
Pry up to lift the shield plate and remove it from the device.
-
You can reuse the pink thermal compound if you're careful. Keep the compound clean and make sure it makes solid contact between the heat sink and the shield during reassembly.
-
If you need to replace it, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate compound, such as K5 Pro, during reassembly.
クリエイティブコモンズのオープンソース著作権のもと、あなたの投稿は著作権の対象となります。