手順 14を翻訳中
手順14
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Time for our favorite part, chip identification!
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Samsung K3PE7E00M-XGC1 8 Gb LPDDR2.
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Hynix H8BCS0QG0MMR memory MCP containing Hynix DRAM and STM flash
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Qualcomm MDM6600 supporting HSPA+ speeds of up to 14.4 Mbps
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The Qualcomm PM8028 chip works in conjunction with the Qualcomm MDM6600 to provide wireless data connection to the phone.
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Motorola T6VP0XBG-0001 LCM 2.0 LTE baseband processor.
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ZE55431140KHD, which appears to be the RAM sitting atop the main processor.
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How do we know the processor is lurking beneath? Check out the chip package-on-package goodness in the second image. The processor is the orange chip beneath the RAM.
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