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注意:あなたはさきほど閲覧しているガイドの前提となるページを編集しています。あなたが行った変更は、この手順を含むガイド全体に影響を与えます。

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手順 4を翻訳中

手順4
Repeat the heating and cutting procedure for the remaining three sides of the phone. Leave an opening pick under each edge to prevent the adhesive from resealing. Leave an opening pick under each edge to prevent the adhesive from resealing.
  • Repeat the heating and cutting procedure for the remaining three sides of the phone.

  • Leave an opening pick under each edge to prevent the adhesive from resealing.

持ち上げた際の隙間が十分にできたら、背面ガラスとミッドフレームの間に開口ピックを差し込みます。

[* black] Once you've opened a large enough gap, insertRepeat the heating and cutting procedure for the remaining three sides of the phone.
[* black] Leave
an opening pick between the rear glass andunder each edge to prevent the midframeadhesive from resealing.
[* black] Once you've opened a large enough gap, insertRepeat the heating and cutting procedure for the remaining three sides of the phone.
[* black] Leave
an opening pick between the rear glass andunder each edge to prevent the midframeadhesive from resealing.

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