Ethan Zuo

Exciting news! I’m pretty surprised that Valve used a custom-designed AMD APU instead of an off-the-shelf variant like the 4800U or something.

Interesting how Valve went with a full-custom APU from AMD. I thought they’d use an off-the-shelf chip like the 4500U.

Fairphone making a hard-to-repair device…this is strange. While I understand that these are tiny wireless earbuds, even the Samsung Beans did better than this.

I know it’s not the focus of the video, but it’s great to see that the PMIC is cooled via a thermal pad at least. I wonder if the M1 is undervolted to fit the iPad’s power and thermal constraints as well.

It’s a nice little detail that the SoC is cooled from both the front and the back. Does the PMIC also get cooled by a heatsink?

Yes, thermal paste can be used. I strongly recommend Thermal Grizzly Kryonaut, as it’s the second-best-performing non-metallic thermal paste on the market (the only better performer is Kryonaut Extreme).

This comment aged like fine wine with the launch of the M1-based iMacs.

Samsung making less repairable earbuds: “It’s evolving, just backwards.”

Adhesive pull tabs are wonderful. I wonder why Apple won’t use them on their Macbooks (and why more electronics designers aren’t using them as well). They’re low-cost, very convenient, take up very little space, and are satisfying to pull.

I wonder how Apple manages to keep thermals under control. Usually, the top of the SoC is cooled in most phones, but it looks like the only method of cooling this device is through the back of the logic board. I know it works, but it just doesn’t seem like the best solution.