Skip to main content
英語
日本語

手順 18を翻訳中

Step 18
Let us take a look at what silicon is so heavily guarded by the charging case: STMicroelectonics STM32L072 ARM Cortex-M0+ MCU Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?
  • Let us take a look at what silicon is so heavily guarded by the charging case:

  • STMicroelectonics STM32L072 ARM Cortex-M0+ MCU

  • Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?

  • NXP 1610A3 charging IC (as seen in iPhones 6s and SE and both iPad Pro models)

  • Texas Instruments BQ24232 power management IC

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

クリエイティブコモンズのオープンソース著作権のもと、あなたの投稿は著作権の対象となります