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手順 2を翻訳中

手順2
Use a metal spudger or prying device to begin levering the case halves apart. Do not push the prying device too far into the case, as this could damage the EMI shields or other components. The case will be most stubborn near the grey power inlet, as this piece is glued to the case halves. Focus on separating the other parts of the case first.
  • Use a metal spudger or prying device to begin levering the case halves apart.

  • Do not push the prying device too far into the case, as this could damage the EMI shields or other components.

  • The case will be most stubborn near the grey power inlet, as this piece is glued to the case halves. Focus on separating the other parts of the case first.

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ここに翻訳を挿入する

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