メインコンテンツにスキップ
英語
日本語

手順 16を翻訳中

手順16
Lightly heat the areas in red with your heat gun to soften the adhesive underneath the logic board. Don’t heat this area too much, excessive heat will fry the speaker. Once heated, gently pry the logic board up with a cell phone opening tool.
  • Lightly heat the areas in red with your heat gun to soften the adhesive underneath the logic board.

  • Don’t heat this area too much, excessive heat will fry the speaker.

  • Once heated, gently pry the logic board up with a cell phone opening tool.

  • Make sure to angle the cell phone opening tool under the red speaker wire located at the bottom left of the device before prying upwards.

  • Lift the bottom of the logic board out of the casing with your fingers.

  • The front facing camera may still be attached by adhesive. Using a metal spudger, gently pry the front facing camera from the casing.

  • Remove the logic board from the steel casing.

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

クリエイティブコモンズのオープンソース著作権のもと、あなたの投稿は著作権の対象となります