手順番号14–iPhone 4 Verizon Teardownを翻訳

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日本語

手順 14を翻訳中

手順14

The back side of the Verizon logic board (on top) contains:
Qualcomm MDM6600
Toshiba TH58NVG7D2FLA89 16 GB NAND Flash
Toshiba Y890A111222KA
RS KMOD16104 - The logo on this package appears to be that of Murata's. We suspect that this contains the Broadcom BCM4329 that reportedly provides Wi-Fi/Bluetooth connectivity.
Adding credibility to this statement is the fact that we found this chip last June in the GSM iPhone 4 and that Murata and Broadcom have had RF partnerships in the past.

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