手順 10を翻訳中
手順10
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What sorts of chips have been forged for the Fire Phone? Let's see:
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Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU is layered underneath)
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Samsung KLMBG4GEAC-B001 32 GB eMMC NAND Flash
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Qualcomm WCD9320 audio codec
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Qualcomm QFE2320 multiband power amplifier
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InvenSense MPU6500 (labeled as MP65 G266B1 L1351)
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NXP 47803 NFC controller
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