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手順 8を翻訳中

手順8
And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog: Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM
  • And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:

  • Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM

  • 128 GB Toshiba UFS 3.0 storage

  • Qorvo 78052 RF Fusion MHB front-end module

  • Microsoft X904163 display driver

  • Qualcomm SDR8150 LTE Transceiver

  • Qualcomm WCD9340 audio codec

  • Qualcomm PM8150 power management ICs

Ed eccoci al momento topico: i chip! Molti elementi risalgono all'anno scorso, il che non significa che il catalogo non sia interessante:

Qualcomm Snapdragon 855, nello strato sottostante ai 6 GB di DRAM SK hynix

128 GB di UFS 3.0 Toshiba

Modulo front end Qorvo 78052 RF Fusion MHB

Driver schermo Microsoft X904163

Ricetrasmettitore LTE Qualcomm SDR8150

Codec audio Qualcomm WCD9340

Circuiti integrati di gestione alimentazione Qualcomm PM8150

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