メインコンテンツにスキップ

修理を始めるには

修理する権利

ストア

注意:あなたは必要条件ガイドを編集しています。あなたが行なう変更は、この手順を含む全ての8個のガイドに反映されます。

英語
日本語

手順 6を翻訳中

手順6
As you proceed with separating the adhesive, you might need to re-apply heat to each edge before you can slice the adhesive securing it. Additionally, you can use multiple opening picks for this process, leaving one in place on each side after you finish slicing to prevent the adhesive from re-adhering as it cools. Slide the opening pick along the left edge of the phone to slice through the adhesive securing the rear panel.
  • As you proceed with separating the adhesive, you might need to re-apply heat to each edge before you can slice the adhesive securing it.

  • Additionally, you can use multiple opening picks for this process, leaving one in place on each side after you finish slicing to prevent the adhesive from re-adhering as it cools.

  • Slide the opening pick along the left edge of the phone to slice through the adhesive securing the rear panel.

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

クリエイティブコモンズのオープンソース著作権のもと、あなたの投稿は著作権の対象となります