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手順 12を翻訳中

手順12
Double the phone, double the fun! Found on the right side's main board: Samsung K3UHAHA0AM-AGCL 12 GB RAM layered over Qualcomm Snapdragon 855
  • Double the phone, double the fun! Found on the right side's main board:

  • Samsung K3UHAHA0AM-AGCL 12 GB RAM layered over Qualcomm Snapdragon 855

  • Samsung KLUFG8RHDA-B2D1 512 GB eUFS NAND flash storage

  • Qorvo QM78062, likely a RF Fusion front-end module

  • Qualcomm SDR8150 RF transceiver

  • Murata KM9705076 front end module (likely)

  • Maxim MAX77705C PMIC

  • IDT P9320S Wireless charging IC

¡Teléfono doble, el doble de diversión! En el lado derecho de la placa principal:

12 GB de RAM Samsung K3UHAHA en capas sobre Qualcomm Snapdragon 855

512 GB de memoria flash eUFS Samsung KLUFG8RHDA-B2D1 5

Qorvo 78062, posiblemente un módulo front-end RF Fusion

Qualcomm SDR8150

Murata KM9705076

Maxim MAX77705C PMIC

IDT P93205

[* black] Double the phone, double the fun! Found on the right side's main board:
- [* red] Samsung K3UHAHA 12 GB RAM layered over Qualcomm Snapdragon 855
- [* orange] Samsung KLUFG8RHDA-B2D1 512 GB eUFS flash storage
- [* yellow] Qorvo 78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
- [* green] Qualcomm SDR8150
- [* light_blue] Murata KM9705076
+ [* red] Samsung [link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UHAHA0AM-AGCL/|K3UHAHA0AM-AGCL] 12 GB RAM layered over Qualcomm Snapdragon 855
+ [* orange] Samsung KLUFG8RHDA-B2D1 512 GB eUFS NAND flash storage
+ [* yellow] Qorvo QM78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
+ [* green] Qualcomm SDR8150 RF transceiver
+ [* light_blue] Murata KM9705076 front end module (likely)
[* blue] Maxim MAX77705C PMIC
- [* violet] IDT P93205
+ [* violet] IDT P9320S Wireless charging IC

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