メインコンテンツにスキップ
英語
日本語

手順 8を翻訳中

手順8
Next to come out are the fan and heat sink. Nintendo designers explained that the larger fan and heat sink were necessary to handle the nearly tripled heat output from the new ICs. With the heat sink off, we get closer to the CPU and GPU, called the Wii U's multi chip module (MCM), still hidden beneath a thermal pad.
  • Next to come out are the fan and heat sink.

  • Nintendo designers explained that the larger fan and heat sink were necessary to handle the nearly tripled heat output from the new ICs.

  • With the heat sink off, we get closer to the CPU and GPU, called the Wii U's multi chip module (MCM), still hidden beneath a thermal pad.

  • Thanks to the upgraded AMD GPU, the Wii U boasts HD graphics up to 1080p.

  • Nintendo has come a long way over the years, considering that we remember when Mario had fewer bits than our old 26-bit driver kit.

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

ここに翻訳を挿入する

クリエイティブコモンズのオープンソース著作権のもと、あなたの投稿は著作権の対象となります