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手順 11を翻訳中

手順11
The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board. Chipwise, we spy: Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM layered underneath
  • The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.

  • Chipwise, we spy:

  • Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM layered underneath

  • Toshiba THGBX4G7D2LLDYC 16 GB NAND flash

  • USI 339S00450 WiFi/Bluetooth module, likely with a Broadcom BCM43572 trapped inside

  • Apple/Dialog 338S00100-AZ PMIC

  • Interestingly, the reverse has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

下一张出来的部件包含那些精致的抽绳系具-在此之后,是它的主板。

芯片明智的, 我们完整地看到:

苹果A8 APL1011 SoC(我们之前已经看到过这个,但是做了一个不同的工作),似乎与下面的1 GB RAM配合

东芝THGBX4G7D2LLDYC 16 GB NAND闪存

USI 339S00450(WiFi /蓝牙模块?)

338S00100-AZ

有趣的是,反面还有一些未填充的SMD焊盘,只有少量芯片和几个无源器件。 也许在最后时刻HomePod进行了一些设计变更?

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