手順8に変更
- Paige Reismanによって編集
承認済みの編集 : Paige Reisman
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手順ライン
| - | [* black] Next to tackle: heat sink assembly |
|---|---|
| - | [* black] Weird spacer standoff as found in 27" iMacs |
| - | [* black] Look at this beast |
| - | [* black] The black plastic bit on the assembly appears to be a channel to direct airflow through the radiator fins. |
| - | [* black] Each radiator fin (and therefor each processor) gets airflow from the fan near it, but a heat pipe also connects the two assemblies, allowing leveling and additional cooling (probably). |
| + | [* black] Next, we mine for Copper, extracting the shiny heat sink. |
| + | [* black] A weird spacer standoff, reminiscent of the [guide|19644|27" iMacs|stepid=49812|new_window=true], houses the screw holding this beast in place. |
| + | [* black] From what we can tell, the heat sink appears to offer double the cooling power: |
| + | [* black] The black plastic portion of the assembly appears to be a channel, directing airflow from the nearby fan through the radiator fins, and ultimately to each processor. |
| + | [* black] A heat pipe also connects the two assemblies, allowing leveling and, probably, additional cooling. |
| + | [* icon_note] It looks like Microsoft is getting quite a bit ''cooler'' than its [http://www.iospop.com/wp-content/uploads/2009/11/hodgman-improv-get-a-mac-ads.jpg|late 2000s reputation|new_window=true], if you know what we mean. |