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Kyle Wiensさんによる編集

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[* black] A shot of the logic board minus the steel EMI shield.
[* black] The manufacturer of the memory has switched from Toshiba on the FCC teardown to Samsung on this device.
[* black] Broadcom BCM5973, which is possibly the same chip that Apple used in the 3rd Gen Touch and the iPhone 3G.
-[* black] The Apple A4, which is marked up quite nicely compared to the FCC photos from yesterday.
+[* black] The Apple A4, is marked up much nicer than the part in [http://s1.guide-images.ifixit.com/igi/V6QetUKjFdDsDYga|the FCC photos] from yesterday.