手順3に変更
手順ライン
| + | [* black] Correct use of the hot air gun can enhance repair efficiency while incorrect use can damage the phone. |
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| + | [* black] The temperature and airflow of the hot air gun must meet special requirements in different scenarios. The component can’t be removed or soldering will be defective if the temperature is set too low while components and PCB board will be damaged under high temperature. |
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