Use the plastic opening tool to separate the two pieces that form the outer case of the phone.
Prying the two pieces apart may be difficult. Carefully apply a moderate amount of pressure when attempting to separate the two pieces or else you will risk breaking them.
Apply a small amount of force when removing the broken speaker from the motherboard. If you apply a large amount of force, you may rip out the wires and damage the motherboard.
Remove the wire attached to the speaker from the motherboard using tweezers.
Apply a small amount of force when removing the wire from the motherboard. If you apply a large amount of force, you may rip out the wires and damage the motherboard.