パーツ

パーツは必要ありません。

Place prying device along the side crease of the phone. Place prying device along the side crease of the phone.
  • Place prying device along the side crease of the phone.

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Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges. Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.
  • Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.

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Remove the back casing from the front casing. Force may be necessary.
  • Remove the back casing from the front casing. Force may be necessary.

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Use prying device to remove motherboard from the back of the phone. Use prying device to remove motherboard from the back of the phone.
  • Use prying device to remove motherboard from the back of the phone.

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まとめ

To reassemble your device, follow these instructions in reverse order.

Erica

メンバー登録日: 2011年10月14日

101 ポイント

6のガイドは作成済み

チーム

James Madison, Team 1-49, Allen Fall 2011 James Madison, Team 1-49, Allen Fall 2011人のメンバー

JMU-ALLEN-F11S1G49

3 メンバー

8のガイドは作成済み

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