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2014年9月19日に発売されたiPhone 6の修理情報とガイドです。モデル番号 A1549、A1586、A1589。

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Why I am I not getting round soldering balls when tinning pads

Hi Good day,

I have extremely new to microsoldering. I have a hakko fm 203 with a Hakko, T15-BC1, Soldering Tip, Bevel, 1mm x 11.5mm to solder. I am practicing removing BGA chips, tinning the pads and applying the Chips back on, however, a major issue I seem to be having a getting rounded solder balls. I am not sure if Its the way I am holding the soldering iron or if it I using the wrong tip entirely (I do use flux when attemping this but my pads seem to look horrible). Any suggesstions?

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I am not sure what you mean by “solder balls” but the tip you are using would not produce enough heat to properly tin pads on some iPhones. You should be using a BC2.

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@imicrosoldering

Chris, I think he's trying to re-ball the chip. I used a metal frame and pre-made balls which I would carefully get one ball into each hole in the frame. Making sure to use the correct ball given the diameter of the pads. When I had the dexterity to do it years ago. While not the best quality vid here's the process How to reballing a bga chip?

さんによる

Hey, I am actually trying to tin the pads on the board. I know the pads are suppose to be fluffy in a sense when tinning them. For example when doing the touch ic repair

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@mikes5124 - Are you using the correct flux, solder and heat settings on your iron?

Tinning is just making the solder pad wet with solder. Generally, when placing a chip on the logic board we don't want a mound when working with BGA chips as the contacts are just too small without creating a short (review the vid).

Small SMT devices which have fewer contacts and often much larger pads can be soldered with a solder mound. Some chips only have contacts around the edge not in an array across the bottom these too can be soldered with a solder mound.

I often soldered small BGA devices which only had 3x3 or 4cx4 arrays building a mound on the chips but these chips also had enough of a gap between the pads and often had larger pads that allow one to do that. I also used a hot air station not a soldering iron.

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@mikes5124 You will not be able to tin pads properly using the BC1 tip. The only way to achieve this on an iPhone 7 would be to pre-heat the board to about 100c. Also what solder are you using, leaded or unleaded?

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@danj It can be painful can’t it Dan, I have been trying to re-ball SMC’s with no stencil it takes me about an hour than only to find that that SMC doesn’t work either.

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The answer, for BGA chips, is: Don’t. Clean up the pads on the board, displace the factory lead free solder with leaded, but don't try to build balls on the board. Leave very little.

With a stencil and solder paste you’ll have quite good control over the size of the balls that go on the chip. You won't achieve anywhere near the same concistancy if trying to build balls or large mounds on the board “manually”, and you’ll run a high risk of undersized ones not making contact and large ones lifting the whole chip so many others don't make contact.

Don’t prebuild balls or mounds on the board pads of other types of chips (non-BGA) either, if only working with an iron, or your chip won't seat on the board because you can only melt one joint (or side) at a time.

If you (or anyone else starting out) see this: Don't cheap out on super cheap stencils. They can be a real headache to work with, and the last thing you need starting out is fighting your tools while learning. You don't need to go all out with 3d stencils, but stencils with little studs on one side that aligns the chip correctly with the stencil, is a godsent. Also get stencils eith rounded square holes. These release the chip/balls much easier after melting the paste. If buying larger multi-chip stencils, or single-chip stencils for large chips, you may want to consider direct-heat stencils. These have slots cut into them along the sides of the chip footprint, that drastically reduces stencil warping when heating.

As others have mentioned, a BC1 tip is not really your friend for working on these board pads like that, there's just too little thermal mass in the tip, and iphone/ipad/mac boards will instantly soak it up, making it too cold. You really wanna be using the biggest tip and contact area you can safely and precisely navigate in the area you're working. This goes for soldering in general, not just this particular example. If cleaning up and prepping pads for BGA soldering, I would suggest you get yourself a BCM2 tip. Its also awesome for drag soldering and nipping out solder bridges. It has a small indent in the tip, which will hold or wick a bit of solder. Some also use K/KN tips for pad work. You can get fairly good knock-offs of T12 tips (identical to T15, just different model name for diffeeent markets) for just 3-4 bucks a pop if buying 3-4 or more at a time. They're probably 80-85% there, so its an affordable way of trying out different types to find which types work best for you, your work snd technique. Then you can get the real deal once you got it narrowed down.

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MICHAEL JABARI NELSON さん、ありがとうございました!
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