修理を始めるには コミュニティ ストア

2015年9月25日に発売。モデルA1687/A1634。このデバイスの修理は前モデルと似ています。スクリュードライバーとこじ開けるツールが必要です。GSM もしくは CDMA。容量は16、64か128 GB。カラーはシルバー、ゴールド、スペースグレイ、ローズゴールド。

1041回答 すべてを表示

オプション

ran over and now bootloping

a customer brought in a 6s plus that was ran over by a car. they want to get it fixed to retrieve the data thats in the phone still. surprisingly the board dosent look bad and the housing wasnt even bent or anything. the issue im having is when i initially connect it to dc power it draws .01a for a second then goes to 0 and stays, until i prompt to boot. it turns on a shows the apple logo for about 3-5 seconds then cuts off again. (while it is on the boot current seems normal.) i havent tried to update or restore because i dont want to risk the data. so far all ive done is measure nand power rails and reball the nand to no avail. i also did a full visual inspection and cant find any cracked or visually damaged components. just posting to get some ideas

回答がありました！ 回答を表示 同じ問題があります

この質問は役に立ちましたか？

はい いいえ
スコア 0
コメントを追加

1 件の回答

フィルタ：
参考になった順 新しい順 古い順
ベストアンサー

オプション

It’s a pretty risky approach to just reball the NAND without really understanding what’s wrong with the device. You could damage the chip or the logic board during the process, to the point where it becomes difficult to retrieve data.

When dealing with a dead device, spend some time to do at least some rudimentary probing. Check the main power lines and the main PMIC outputs (PPCPU/GPU, SOC, FIXED, SDRAM, NAND etc). If that looks good, then check the main BBPMU outputs.

Because the phone was crushed, it may just end up being a few bad solder balls somewhere but before applying tons of heat, try to rule out the easy stuff, like subsystem shorts.

このアンサーは役に立ちましたか？

はい いいえ
スコア 2

5 件のコメント:

i checked the main power rails and did probe around a bit before just reballing the nand. i did that because i saw a dent in the back of the phone near the nand and it was tuning on just not booting up. i got it working now so all is good. ty the the input though

さんによる

just cba listing every point that i probed if i can even remember them all... lol

さんによる

also how is reballing the nand risky? its pretty straight forward. with large balls far apart and no nearby underfilled chips. the only thing on the other side of the board is the sim tray.

さんによる

On an iPhone logic board, underfilled parts are never really far away :>). Applying heat for anything always has risks. If you lift a pad or are not sure the chip was properly seated, then you have to rework the pad and apply heat a second time to double check.

Of course, you're skill level will have a direct correlation with success, still, it's a "best practices" point of view.

さんによる

Thanks Luke!

さんによる

コメントを追加

回答を追加する

lukerockhill さん、ありがとうございました！
統計データ:

過去 24時間: 0

過去 7 日: 0

過去 30 日: 0

今までの合計 60