iPhone 6s NAND flash IC missing/broken pad

Question

iPhone 6s

2015年9月25日にAppleから発売されたiPhone 6Sの修理情報とガイドです。モデル A1688、A1633。

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Xoh Eyb @xoheyb

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投稿日: 2018年11月9日

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iPhone 6s NAND flash IC missing/broken pad

Hi,

After I reballed by iPhone 6s nand ic using stencil, I broke one pad(3rd row from top). Can someone tell me whether that pad matters or not? You can see the photo:

Front Image and Back Image(IC flipped towards left )

Here is the NAND IC diagram from REWA technology:

Can you please compare the IC pads with those in the image to confirm whether it’s okay to proceed with this IC.

Thanks

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arbaman @arbaman

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投稿日: 2018年11月10日

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That’s a ground pin, it should be fine even without it.

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Thanks for the answer. I will solder it and see how it goes. I can see on the schematics these pads are shown as red and white/greyish dots. Are white dots ground or red ones are ground?

Xoh Eyb さんによる2018年11月10日

@xoheyb I can't tell for sure, it depends on the color attributes one decides to use on his boardview sotware. I'd be inclined to think white is for ground and red for active pads.

arbaman さんによる2018年11月10日

@arbaman I have added a photo and edited my question for more information. Can you please have a look? Thanks

Xoh Eyb さんによる2018年11月11日

@xoheyb That's correct of course, white is ground and grey unconnected. Remember the direction of the chip, your picture is upside down when compared to boardview.

arbaman さんによる2018年11月11日

Thanks for your reply @arbaman. Okay so the broken pad on the IC i posted is one for those grey coloured pads in bottom portion of the IC schematic right? And I can use this IC without any fear of damage caused by broken pad. I was actually comparing the broken pad(5th pad on 4th row from top) to the same top row on the schematic and was confused as there is a red pad. So it’s upside down.

Xoh Eyb さんによる2018年11月11日

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Thanks for the answer. I will solder it and see how it goes. I can see on the schematics these pads are shown as red and white/greyish dots. Are white dots ground or red ones are ground? — Xoh Eyb
@xoheyb I can't tell for sure, it depends on the color attributes one decides to use on his boardview sotware. I'd be inclined to think white is for ground and red for active pads. — arbaman
@arbaman I have added a photo and edited my question for more information. Can you please have a look? Thanks — Xoh Eyb
@xoheyb That's correct of course, white is ground and grey unconnected. Remember the direction of the chip, your picture is upside down when compared to boardview. — arbaman
Thanks for your reply @arbaman. Okay so the broken pad on the IC i posted is one for those grey coloured pads in bottom portion of the IC schematic right? And I can use this IC without any fear of damage caused by broken pad. I was actually comparing the broken pad(5th pad on 4th row from top) to the same top row on the schematic and was confused as there is a red pad. So it’s upside down. — Xoh Eyb

iPhone 6s

iPhone 6s NAND flash IC missing/broken pad

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