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2014年9月19日に発売されたこのiPhoneは4.7インチのスクリーンサイズでiPhone 6 Plusの縮小版です。

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iPhone 6 NAND data recovery


I've got a customer's iPhone 6 board (yes, only the board) and she would like to retrieve the data. The board is cracked near the battery connector (long history) and not working.

I've read some comments about transfer NAND and CPU to another board and I would like to try this.

So, my first doubt is about the components. I need to access the data, what is the IC that I need to transfer?

My second doubt is about the techniques. I have a good iPhone 6 board and some tools (hot gun esd safe, stencil for re-ball, scalpel, esd safe working table, etc), but I would like some tips about correct temperature to scrape the resin and take off the IC .

And the last is about how to get the correct alignment for this IC.

I am not totally untrained about it, I replaced and re-baling some x-box cpu, but it is other size and resin ...



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Honestly, do not even try. Some of the most experienced techs I know cannot do this job. Taking off the Baseband, NAND, EProm is not the problem... it is successfully being able to remove the CPU and RAM without it warping.

You will end up wasting a good board. I am not trying to tell you 100% not to do it, if you have the proper tools and experience in this type of repair but I have tried many times unsuccessfully and have a little over a years experience Replacing and reballing, repairing Iphones.

If you are determined to try anyway, start with the CPU Ram, then the CPU. If you get them off and reball without warping or damaging... the rest is a breeze. You will need the NAND, Baseband and EProm after.

Best of luck!

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Felipe Kashiwagura will be eternally grateful.
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