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I've read the whole RROD Fix Kit-Guide and I think it should be possible for me to do all the steps.
But...
It is said that the RROD problem is due to a cracked or cold solder joint underneath the GPU. When I read the guide I wonder in which of these steps the solder joints get reattached.
In the YLOD-Fix Kit for the PS3 there is a heat gun needed to fix the cold solder joints...
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I believe that this is due to the kit applying pressure and dispersing the heat. You would need a heat gun if you wanted to reflow the board..but those are just my 2 cents.
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Yup, you hit the nail on the head. By eliminating the X-clamps and replacing them with machine screws, the broken solder joints are essentially squeezed back together. Note, though, that this is not a guaranteed fix and that a heat gun may be needed to reflow some really badly cracked joints under the CPU/GPU and a heat gun will be required to reflow cracked solder joints under any of the other ICs on the board.
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The pressure from the screws that replace the X-Clamps is enough to keep the solder joint intact. Usually, it is procedure to "Overheat" the xbox after performing the fix by unplugging it's fans and running it until it gets 2RROD to rebond the chips. This isn't always nessicary, because the heat from the xbox over time will do the same thing.
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@oldturkey03 is correct however i would use the heat gun any way. also just my 2 cents
Good Luck,
Cody
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edit: Thanks for the answers! I think I'll do it like in the guide and if it doesn't work I'll try to overheat it. I just don't want to do it, if it's not necessary.
C1ty Hunt3r さんによる