オリジナル投稿者： Sami

タイトル:

Any component on the PCB bottom size?

テキスト:

I found the thickness of Ipad pro 13" is only 5.1mm.

From the tear down video on YT, I saw it using the Apple logo for thermal dissipation. I guess  that the PCB bottom should be contacted with logo directly.

Can you please help to confirm this?

デバイス:

iPad Pro 13"

ステータス:

open