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現在のバージョン作成者: tns ,

テキスト:

Yes, the photo shows empty pads where at least two of the four components were pried off the board. I can see at least one of these parts sitting nearby. You must remove these loose, damaged components and solder new parts on the board. Loose parts can bounce around inside your phone and cause more damage. I believe the reference designators for the SE are C2400, FL2400, C2410, C2411. Three Capacitors and one Filter.
Yes, the photo shows empty pads where at least two of the four components were pried off the board. I can see at least one of these parts sitting nearby. You must remove these loose, damaged components and solder new parts on the board. Loose parts can bounce around inside your phone and cause more damage. I believe the reference designators for the SE are C2400, FL2400, C2410, C2411. Three Capacitors and one Filter.

ステータス:

open

オリジナル投稿者: tns ,

テキスト:

Yes, the photo shows empty pads where at least two of the four components were pried off the board. I can see at least one of these parts sitting nearby. You must remove these loose, damaged components and solder new parts on the board. Loose parts can bounce around inside your phone and cause more damage. I believe the reference designators for the SE are C2400, FL2400, C2410, C2411. Three Capacitors and one Filter.

ステータス:

open