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現在のバージョン作成者: Ben ,

テキスト:

It’s either a component knocked off near one of the logic board connectors or one or more pads are ripped between the two boards that are sandwiched together that make up the iPhone X board.
 
 
 
Note that the pads being ripped between the board are common to occur when the phone has been dropped pretty hard.

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オリジナル投稿者: Ben ,

テキスト:

It’s either a component knocked off near one of the logic board connectors or one or more pads are ripped between the two boards that are sandwiched together that make up the iPhone X board.

ステータス:

open