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現在のバージョン作成者: Keith Hovey ,

テキスト:

-I work for a company where I specialize in asset recovery. I will not name the company but I will give some insight as this has been an issue plaguing PS4 Owners for quite some time.
+*UPDATED*
-BLOD has a few sources to the issue so Im assuming that the console has a self check it does at boot similar to what a PC does when it starts up and upon an error either it protects its self and shuts off immediately or posts no video and is stuck in some kind of loop. With that being said.... Since we get in a few hundred of these a month I looked into it and came up with a solution.
+Reball is an unnecessary option for most consoles. If you follow the online guides and such (for dealing with HDMI issues) with no luck it is most likely a connection failure in a corner of the APU, a connection failure on the Network co-processor, or a bad power supply. I say this because when we removed the APU on our early test units (and the co-processors as of recently) we used for our research we found that the solder balls in the grid on a few corners of these chips were cleanly detached and oxidized. You can see this for yourself if you ever reball or remove the chips from the board in general.
-Reball is an unnecessary option for most consoles. If you follow the online guides and such (for dealing with HDMI issues) with no luck it is most likely a connection failure in a corner of the APU. I say this because when we removed the APU on our early test units we used for our research we found that the solder balls in the grid on a few corners of the APU were cleanly detached from the apu and oxidized. With a sufficient amount of flux applied at 200 Degrees Celsius (which was very little flux by the by) and reflow accomplished at around 225 to 230 celcius we managed to recover around 80% of these problematic units. Yes we waited to introduce the flux until the temp hit 200. This was able to be done with really low tech equipment. In the end we used a skillet, a heatgun, a non contact thermometer, and a contact thermometer for control to achieve this widespread. We also found that some of the units did in fact have failed PSU (less than a percent) and that some of the units had the same issue at the co-processor or a ram chip (around 10%).
+With a sufficient amount of flux applied at 200 Degrees Celsius (which was very little flux by the by) to each corner and to the edges in between (a little flux really goes a long way) and reflow accomplished at around 225 to 230 celcius we managed to recover around 85% of these problematic units. Yes we waited to introduce the flux until the temp hit 200 because when introduced at that temperature most if not all of the flux evaporates very quickly leaving behind nice clean connections. This was able to be done with really low tech equipment. In the end we used a skillet tapped with a few mounts, a heatgun, a non contact thermometer, and a contact thermometer for control to reflow all of the boards that needed it.
-The process of repair now involves changing the psu first, checking the fuses on the board second, if neither fixes the issue or fails the check we reflow the APU and the co-processor. The soak time at 225 is important! No more than just long enough to reflow the grid. Do not exceed 230!! The amount of flux is JUST as important. Just enough to see a little run under the corner of the apu. It is literally just 15 balls max disconnected at sometimes as many as all corners of the APU. Im assuming these are weak points where the flexing of the board and the inflexibility of the apu along with some manufacturer defect end up causing the issue. De-solder an apu and see for yourself!
+The process of repair now involves changing the psu first, checking the fuses on the board second, if neither fixes the issue or fails the check we reflow the APU and the co-processor. The soak time at 225 is important! No more than just long enough to reflow the grid. Do not exceed 235!! We seem to have mixed results when the co processor is taken past 235 Celcius. May be crappy equipment. The amount of flux is JUST as important as the temperatures. Just enough to see a little run under the corner of the apu and same along the edges. We usually just place a drop from a needle at each point (Corner, Middle of edge, Corner). It is literally just 15 balls max disconnected at sometimes as many as all corners of the APU. Im assuming these are weak points where the flexing of the board and the inflexibility of the apu along with some manufacturer defect end up causing the issue. We have also noticed that in rare cases the APU itself is actually warped.

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オリジナル投稿者: Keith Hovey ,

テキスト:

I work for a company where I specialize in asset recovery.  I will not name the company but I will give some insight as this has been an issue plaguing PS4 Owners for quite some time.

BLOD has a few sources to the issue so Im assuming that the console has a self check it does at boot similar to what a PC does when it starts up and upon an error either it protects its self and shuts off immediately or posts no video and is stuck in some kind of loop.  With that being said....  Since we get in a few hundred of these a month I looked into it and came up with a solution.

Reball is an unnecessary option for most consoles.   If you follow the online guides and such (for dealing with HDMI issues) with no luck it is most likely a connection failure in a corner of the APU.  I say this because when we removed the APU on our early test units we used for our research we found that the solder balls in the grid on a few corners of the APU were cleanly detached from the apu and oxidized.  With a sufficient amount of flux applied at 200 Degrees Celsius (which was very little flux by the by)  and reflow accomplished at around 225 to 230 celcius we managed to recover around 80% of these problematic units.   Yes we waited to introduce the flux until the temp hit 200.  This was able to be done with really low tech equipment.  In the end we used a skillet, a heatgun, a non contact thermometer,  and a contact thermometer for control to achieve this widespread.  We also found that some of the units did in fact have failed PSU (less than a percent) and that some of the units had the same issue at the co-processor or a ram chip (around 10%).

The process of repair now involves changing the psu first, checking the fuses on the board second, if neither fixes the issue or fails the check we reflow the APU and the co-processor.  The soak time at 225 is important!  No more than just long enough to reflow the grid.  Do not exceed 230!!  The amount of flux is JUST as important.  Just enough to see a little run under the corner of the apu.  It is literally just 15 balls max disconnected at sometimes as many as all corners of the APU.  Im assuming these are weak points where the flexing of the board and the inflexibility of the apu along with some manufacturer defect end up causing the issue.  De-solder an apu and see for yourself!

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open