メインコンテンツにスキップ
ヘルプ

オリジナル投稿者: oldturkey03 ,

テキスト:

MichaelTunnell, the kit is strictly proving additional pressure on the GPU/CPU to try to close cracks in the solder joints. Combining this with a reflow with a heat gun may just complete a good repair. Check [guide|3550|on here] step 49 will explain it. Check [guide|5845|on here|stepid=25864] for the reflow guide. Also "remember that all that this kit is trying to accomplish, is to close cracked solder joints. Most of the time the extra few pounds of torque provided by the kit, will close those cracked joints. It is not a permanent fix, nor is it a sure thing either. '''It all depends on the individual logic board and the damage to the solder joints.''' I strongly suggest a reflow with this kit. The chances to be successful is greater with a combination of RROD kit and a reflow. Of course, a permanent fix would be a total reball. for a reball to be done, you will need the stencil, a rework machine as well as the proper reball temperature template. If you do not have those tools, you can not do a reball. This will give you a pretty good idea on how to do it. As I mention in here, even a reflow may not be a sure thing either. It depends how you did it, how much experience you have to reflow it, and how bad the GPU solder has cracked. I suggest a reball to get it permanently fixed. Hope this helps, good luck

ステータス:

open