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オリジナル投稿者: oldturkey03 ,

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zachbelmont, it most certainly will yield a higher success if you do. The kit is strictly proving additional pressure on the GPU/CPU to try to close cracks in the solder joints. Combining this with a reflow with a heat gun may just add to a good repair. Check [guide|3550|on here|page=7] step 49 will explain it. Check [guide|5845|on here|stepid=25864] for the reflow guide. Hope this helps, good luck.

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