オリジナル投稿者： oldturkey03 ,
zachbelmont, it most certainly will yield a higher success if you do. The kit is strictly proving additional pressure on the GPU/CPU to try to close cracks in the solder joints. Combining this with a reflow with a heat gun may just add to a good repair. Check [guide|3550|on here|page=7] step 49 will explain it. Check [guide|5845|on here|stepid=25864] for the reflow guide. Hope this helps, good luck.